AMTECH RMA-223 TF Leaded consider lowering the peak reflow

consider lowering the peak reflow temperature

For safety Datasheet please connect to Safety Data Sheet

5 Clear and free from precipitation Conflict Minerals Compliance Electronic Industry Citizenship Coalition (EICC) Compliant REACH Compliance Articles 33 and 67 of Regulation (EC) No 1907/2006 Contains no substance >0

To achieve better results with voiding or to reduce tombstoning

nonflammability and low toxicity make it useful for other industrial applications such as specialty solvent and heat transfer applications

AMTECH RMA-223 TF Leaded consider lowering the peak reflowDOWNLOADS Technical Data Sheet Safety Data Sheet Product Info AMTECH RMA 223 TF is formulated for syringe, stencil printing, and rework applications on all PCB surface finishes. AMTECH RMA 223 TF may be used for BGA sphere attachment and reballing. AMTECH RMA 223 TF is also designed to work on all flip chip bumping and chip scale packaging sites. Product Highlights: ROL0 flux classification Wide process window Excellent wetting compatibility on most