BGA-Bottom-177 HC11 g MC9S12NE64) in QFP80 package

g MC9S12NE64) in QFP80 package (open socket)

I/O) in UBGA56 package (open socket)

The Dataman DIL46/TSOP44-II ZIF 400mil MR-1 is a device specific adapter for MRAM devices in TSOP44 package (e

The Dataman LVT-6408W30-80F is a device specific adapter for Intel 28F6408W18 CSP Flash in UBGA80 package (open socket)

tip to tip size 13

BGA-Bottom-177 HC11 g MC9S12NE64) in QFP80 packageThe Dataman BGA Bottom 177 is the bottom board of BGA adapter for TI Stellaris (Luminary Micro) devices with balls in matrix 16x16 (e. g. LM3S2965). Some adapters are programmer specific and we recommend checking the software for compatibility prior to ordering. Please see our BGA Adapter Selection Guide for more information.